| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a lead frame having been subjected to fall stopping processing so as to exhibit equal fall stopping action in any direction of falling a lead frame of a substrate for a surface mounted electronic component; the substrate for the electronic component using the same; and the electronic component. <P>SOLUTION: The present invention relates to: the lead frame 10 including at least two connection terminals 14 having end edges 15 disposed in a resin molding region opposite each other, opposite end surfaces of the ends end edges 15 being tapered in cross-sections crossing the end edges 15, slanting in the same direction to a direction perpendicular to a plane of the lead frame 10; and the substrate 30 for the electronic component and the electronic component 60 using the lead frame. <P>COPYRIGHT: (C)2011,JPO&INPIT |
