| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface inspection device allowing high-resolution imaging and inspection, even if an inspecting object is large. SOLUTION: The surface inspection device includes: a stage 10 supporting a wafer W; an illumination system 20 for applying illumination light to the surface of the wafer W supported by the stage 10; an objective lens 33 for observably forming an image of the surface of the wafer W with the illumination light applied thereto; an imaging element 35 for photographing an image of the surface of the wafer W formed by the objective lens 33; a camera drive stage 36 for relatively moving the wafer supported on the stage 10 and the imaging region of the imaging element 35; and an image processing unit 45 for generating image of the overall surface of the wafer W, by combining a plurality of partial images of the wafer W taken by the imaging element 35, while changing the imaging region by the drive stage 36. COPYRIGHT: (C)2011,JPO&INPIT |
