APPARATUS FOR SUPPORTING DESIGNING OF WIRING BOARD, WIRING BOARD DESIGNING METHOD, PROGRAM, AND WIRING BOARD

摘要

Disclosed is an apparatus for supporting designing of a wiring board, wherein a via layout information acquiring section acquires via layout information which indicates layout of a plurality of first vias (212). A second conductor information acquiring section acquires second conductor information which indicates the layout positions of a plurality of second conductive bodies (232) repeatedly disposed on a second conductive layer (230). A via extracting section extracts, for respective second conductive bodies (232), the first vias (212) as extraction vias which overlap the second conductive bodies (232). A via selecting section selects, for respective second conductive bodies (232), the predetermined number of first vias (212) as selected vias, from the extraction vias. An opening introducing section introduces, to each of the second conductive bodies (232), a first opening (234) which overlaps, in a planar view, an extraction via which has not been selected by means of the via selecting section.