| 摘要 |
PROBLEM TO BE SOLVED: To shorten the wiring lengths among LSI chips in a multi-chip module. SOLUTION: A plurality of LSI chips 30A-30D are arranged on a silicon interposer 20 with a wiring pattern 26a and each of the LSI chips is connected to the other LSI chips via the wiring pattern 26a, and the plurality of LSI chips and a base substrate 10 are electrically connected to each other via a portion excluding the wiring pattern 26a. In this case, the silicon interposer 20 can be manufactured separately from the base substrate, thereby making a wiring pattern into a micropattern. As a result, the wiring pattern can be made short, and wiring lengths among LSI chips can be shortened also. COPYRIGHT: (C)2011,JPO&INPIT |
