发明名称 THERMOPLASTIC RESIN COMPOSITION, AND HEAT-RADIATION/HEAT-TRANSFERRING RESIN MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a resin composition being excellent in thermal conductivity, being also excellent in performance such as moldability and impact-resistance, and capable of being preferably used as a molding material of an industrial base material, an industrial material and a domestic article. SOLUTION: In the composition, at least a thermoplastic resin having a main chain mainly comprising a repetition unit of a mesogen group and a spacer and mainly comprising a chain form; and a specific amount of a fibrous filler, are formulated. Since the thermoplastic resin has an extremely high symmetrical property, the resin composition having high orientation of a molecule, a precise higher order structure formed, and excellent thermal conductivity is given. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011084716(A) 申请公布日期 2011.04.28
申请号 JP20100100513 申请日期 2010.04.26
申请人 KANEKA CORP 发明人 YOSHIHARA HIDESUKE;EZAKI TOSHIRO;MATSUMOTO KAZUAKI
分类号 C08L101/12;C08K7/02;C08L67/00 主分类号 C08L101/12
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