| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder feeding device which is capable of feeding solder with less impurities and operated for a long time. <P>SOLUTION: In the solder feeding device, ingot solder S is fed to a melting tank 1, the ingot solder S is heated and melted in the melting tank, and molten solder L is discharged from the melting tank 1 in the oxidation preventing atmosphere. A solder feeding chamber 2 is provided, in which one or the predetermined number of ingot solder S is fed, and the ingot solder S is fed in the melting tank. The solder feeding chamber 2 is in an oxidation preventing atmosphere blocked from the outside air. The solder feeding chamber 2 is communicated with the melting tank 1 in this atmospheric state, and the ingot solder S is fed to the melting tank 1 from the solder feeding chamber 2. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
