| 摘要 |
PROBLEM TO BE SOLVED: To reduce the working load for the maintenance of a film deposition apparatus. SOLUTION: The film deposition apparatus includes a pressure-reducible reaction chamber 4, an electrode part 2 provided inside the reaction chamber and having an electrode face 2A, and a heating-cooling head 62 having a heating-cooling surface 62A. The heating-cooling head is movable between the position at which the heating-cooling surface is opposite to the electrode 2 via a certain space, and the position at which the heating-cooling surface is directly or indirectly abutted on the electrode surface of the electrode. The heating-cooling head cools the electrode part to peel off any film deposits 3 deposited on the electrode part. COPYRIGHT: (C)2011,JPO&INPIT
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