| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip chip structure of a semiconductor which has a soldered pillar-shaped bump at a surface joining device. SOLUTION: The flip chip structure of a semiconductor includes a substrate 210, a chip 220, and a first solder 230 and additional solder 240. On the substrate 210, first connecting pads 211 and additional pads 212 are located, and the first connecting pads 211 are arranged on a first arranged line, and along it, the first connecting pad width and the first connecting pad pitch are defined. The first connecting pad pitch is longer than the first connecting pad width. On the chip 220, a group of first pillar-shaped bumps 221 which extrude on the same surface older-jointed to a group of the first connecting pads 211 through a group of the first solders 230 and a group of additional bumps 222 which are solder-jointed to a group of the additional pads 212 through a group of the additional solders 240. COPYRIGHT: (C)2011,JPO&INPIT
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