发明名称 COPPER POWDER FOR CONDUCTIVE PASTE AND CONDUCTIVE PASTE
摘要 Copper powder is provided, which, while having fine granularity and resistance to oxidation, does not lose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.05 to 10 atomic % Bi inside each particle.
申请公布号 US2011095239(A1) 申请公布日期 2011.04.28
申请号 US20100861123 申请日期 2010.08.23
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 OTA KOYU;SEKIGUCHI MAKOTO;YOSHIMARU KATSUHIKO
分类号 H01B1/02 主分类号 H01B1/02
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