| 摘要 |
<p>The invention relates to high thermal conductivity materials, in particular, to copper-diamond composite materials, which can be used as heat exchangers, heat sinks, heat spreaders for electronic and other devices and a method of production thereof. A high thermal conductivity diamond-metal composite according to the invention has a thermal conductivity above 500 W/(m*K) and comprises coated diamond particles in a metal or metal alloy matrix having a thermal conductivity of not less than 300 W/(m*K), wherein the particles are coated with a single-layered continuous high surface area coating comprising a metal and/or carbide of a carbide-forming element selected from IV-VI Group of the Periodic Table, the coating having a thickness of less than 500 nm and a certain degree of surface texture to provide high thermal conductivity of composite.?</p> |
