SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

摘要

The present invention relates to a device (10) comprising a substrate (12) having a front surface (14) and a back surface (24); a semiconductor element (16) provided on the front surface of the substrate; a first passivation layer (18); and a second passivation layer (22) provided on the back surface of the substrate. The present invention also relates to a method of manufacturing such a device.