Wiring board provided with passive element

摘要

A wiring board provided with a passive element, comprising: an insulating board (5) having a first surface and a second surface; a layered dielectrics (26) disposed on the second surface of the insulating board, the layered dielectrics sinking in a thickness direction of the insulating board to be positioned at a first sinking level; a layered electrical conductor (36) disposed under the layered dielectrics to be in contact with the layered dielectrics and to be positioned at a second sinking level under the first sinking level of the insulating board and also disposed to be positioned at a same sinking level as the first sinking level of the insulating board; and a wiring layer (1a) disposed on the second surface of the insulating board and having a first contacting portion with the layered dielectrics and a second contacting portion with the layered electrical conductor, characterized in that the wiring board further comprises: a second layered dielectrics (27) disposed under the layered electrical conductor to be in contact with the layered electrical conductor and to be positioned at a third sinking level under the second sinking level of the insulating board and also disposed to be positioned at same sinking levels as the second and the first sinking levels of the insulating board to be in contact with the layered dielectrics; and a second layered electrical conductor (38) disposed under the second layered dielectrics to be in contact with the second layered dielectrics and to be positioned at a fourth sinking level under the third sinking level of the insulating board and also disposed to be positioned at same sinking levels as the third, the second, and the first sinking levels of the insulating board to be in contact with the wiring layer electrically conducting with the first contacting portion.