| 摘要 |
A light emitting device having a package that has an opening provided with a side surface and a bottom surface, and a lead frame that is exposed to the bottom surface, the lead frame includes a reflection portion bent on the side surface, and a portion of an inner wall surface of the reflection portion is positioned in an inner portion of the package, and a light emitting device having a package that has a recessed portion on a front surface, a lead frame that is exposed to a bottom surface of the recessed portion, a light emitting element that is disposed on the lead frame, and a sealing resin that is filled into the recessed portion, the lead frame includes a bent portion that is bent towards the front surface of the package in the recessed portion, and a projecting portion that is bent to project from the package towards an outer portion, and is disposed on a face opposed to the front surface of the package. |
