CONDUCTIVE ADHESIVE AND LED SUBSTRATE USING THE SAME

摘要

Provided are a conductive adhesive capable of ensuring both conductive properties and adhesion properties and an LED substrate using the conductive adhesive. The conductive adhesive contains a conductive filler, a binder resin, and a solvent as main components thereof, and the conductive filler contains a metal powder having an average particle size of 2 to 30 µm as a main component thereof and contains ultrafine metal particles having an average particle size of 100 nm or less.