MANUFACTURING APPARATUS, TESTING APPARATUS, MANUFACTURING METHOD AND INTEGRATED CIRCUIT PACKAGE

摘要

PURPOSE: An integrated circuit package, a manufacturing method thereof, a manufacturing apparatus thereof, and a testing apparatus thereof are provided to precisely connect a substrate to an integrated circuit chip by planarizing the integrated circuit chip with a vacuum chuck. CONSTITUTION: A planarization unit(74) planarizes an integrated circuit chip. A maintaining unit(76) maintains a base substrate. A carrying unit carries the planarized integrated circuit chip and loads the integrated circuit chip on the base substrate maintained by the maintaining unit. A packaging unit(84) packages the integrated circuit chip and the base substrate as the integrated circuit package. A vacuum chuck unit absorbs the integrated circuit chip loaded on the base substrate and maintains the integrated circuit chip.