| 摘要 |
The invention relates to a method for producing a solder stop barrier (10-16, 20) that comprises at least one solder stop track (10a, 10b, 11a, 11b, 12a, 12b, 13a) disposed on the surface (2) of a support (1). Said solder stop track is located at least in some sections around a solder area (2a, 2b) to be delimited on the support (1). The inventive method comprises the steps of providing a support (1) and producing the at least one solder stop track (10a, 10b, 11a, 11b, 12a, 12b, 13a) by inducing a chemical modification on the surface (2) of the support (1) by the impact of a laser beam (30) along a path, said chemical modification locally reducing the wettability of the surface (2) of the support (1) with liquid solder (4) in the area of said path. |
