| 发明名称 |
Power converter integrated circuit floor plan and package |
| 摘要 |
For a DC to DC converter circuit integrated on a packaged die, the relative positions of various die pads and power MOSFETs on the die for a small outline integrated circuit package are described. |
| 申请公布号 |
EP2315254(A2) |
申请公布日期 |
2011.04.27 |
| 申请号 |
EP20100251198 |
申请日期 |
2010.07.02 |
| 申请人 |
MONOLITHIC POWER SYSTEMS, INC. |
发明人 |
NGUYEN, JAMES H. |
| 分类号 |
H01L29/772 |
主分类号 |
H01L29/772 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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