| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a packaging method of an electronic component in which burnt deposit of a substrate material and bonding failure can be suppressed while suppressing gap in the bonding position of an electrode pad 3 and a bonding electrode 200a. <P>SOLUTION: The packaging method of an electronic component employs such a combination of a mother board 1 and an electronic component 200A as the projection image of a plurality of bonding electrodes 200a in the thickness direction of the board has a part projecting from the projection image of corresponding electrode pad 3 in the same direction when the electronic component 200A is mounted on the mother board 1. In the subsequent bonding process, each electrode pad 3 is irradiated with spot YAG laser light L having a part projecting from each plane and the bonding electrode 200a is irradiated with the part of YAG laser light L projecting from the plane of the electrode pad 3. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
