| 摘要 |
PURPOSE: A printed circuit board and a method of manufacturing the same are provided to maintain tensile strength for long time by forming a circuit wire in an insulating layer with a metal thin film including bismuth within a certain range to suppress the deterioration of the circuit wire. CONSTITUTION: In a printed circuit board and a method of manufacturing the same, the amount of bismuth included in a metal is between 800-3000ppm. The coating thickness of the circuit wiring is between 1-35μm. The tensile strength of the circuit wiring is between 700-800MPa.
|
