发明名称 PROCESS FOR PRODUCING PHOTORESIST PATTERN
摘要 <p>PURPOSE: A method for manufacturing a photoresist pattern is provided to reduce performance deterioration due to the inactivation of acid by adding nitrogen-containing organic base compound as a quencher. CONSTITUTION: A first photoresist film is formed by drying a first photoresist compound after the first photoresist compound including a resin and an acid generator is coated on a substrate. A prebaked first photoresist layer is exposed with radiation. A first photoresist pattern is formed by developing the first photoresist layer which is baked by using a first alkali developer. A coating layer is formed on the first photoresist pattern. A second photoresist layer is formed by drying a second photoresist compound after the second photoresist compound is coated on a coating layer. The prebaked second photoresist layer is exposed with radiation. A second photoresist pattern is formed by developing the baked second photoresist layer using a second alkali developer.</p>
申请公布号 KR20110043466(A) 申请公布日期 2011.04.27
申请号 KR20100100978 申请日期 2010.10.15
申请人 SUMITOMO CHEMICAL CO., LTD. 发明人 HATA MITSUHIRO;HASHIMOTO KAZUHIKO
分类号 H01L21/312;H01L21/027 主分类号 H01L21/312
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