| 摘要 |
<p>PROBLEM TO BE SOLVED: To perform peeling of a wafer having a mirror like surface is vacuum- adsorbed and vacumm-broken with a vacuum tweezer made of quartz glass in such a manner that stress and defects are not generated on the wafer face. SOLUTION: The face of an opening part in a vacuum tweezer adsorbing a wafer is coated with a hard DLC (diamondlike carbon) film having surface smoothness. The thermal expansion coefficient of the DLC film is approximately equal to that of quartz glass, stress on the film is not generated, and the uniform and firm film can be formed.</p> |
