HEAT-RADIATING SUBSTRATE

摘要

PURPOSE: A heat-radiating substrate is provided to reduce power loss using a metal plate as a ground layer and power layer. CONSTITUTION: A heat-radiating substrate comprises: a dielectric layer(20) formed on the surface of a metal plate(10); a circuit pattern(25) on the dielectric layer; a first via(30) which electrically connects the metal plate and circuit pattern by penetrating the metal plate; a through via(32) for connecting with the metal plate.