发明名称 Cooling structure for rackmount-type control device and rack-type storage control device
摘要 According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.
申请公布号 US7933120(B2) 申请公布日期 2011.04.26
申请号 US20100659520 申请日期 2010.03.11
申请人 HITACHI, LTD. 发明人 TANAKA SHIGEAKI;KASAHARA YOSHIKATSU
分类号 G06F1/20;H05K5/00;H05K7/20 主分类号 G06F1/20
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