发明名称 |
Method of teaching eyepoints for wire bonding and related semiconductor processing operations |
摘要 |
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
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申请公布号 |
US7931186(B2) |
申请公布日期 |
2011.04.26 |
申请号 |
US20070093403 |
申请日期 |
2007.03.13 |
申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
DELEY MICHAEL T.;LISTER PETER M.;SOOD DEEPAK;WANG ZHIJIE |
分类号 |
B23K31/00;B23K11/00 |
主分类号 |
B23K31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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