<p>PURPOSE: A high voltage light-emitting diode package is provided to prevent the leak current which may occur in the light emitting diode chips by mounting the light emitting diode chips on the landing pads spaced from each other. CONSTITUTION: A package body(21) has a cavity. Light emitting diode chips(30a, 30b) have a plurality of light emitting cells which are serially connected. The fluorescent substance converts wavelength of the light emitted from the light emitting diode chip. The light emitting cells are serially connected between a pair of lead electrodes. A landing pad(23) is located on the cavity.</p>
