| 摘要 |
PURPOSE: A chip lead frame and a photoelectric energy transducing module are provided to extend the life cycle of the photovoltaic energy conversion module by allowing the heat to be transferred to the heat dissipating module quickly. CONSTITUTION: A chip wiring frame comprises an insulator(32) and a plurality of conductors(34). The insulator comprises a first side, a second side, a first concave structure formed on the first side, a penetration hole, and a discharging structure. The penetration hole passes through the second side and the first concave structure.
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