发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide an epitaxial film-forming apparatus including a sufficient heat insulation structure for processing at high temperature. SOLUTION: A substrate processing apparatus includes: a processing chamber for processing a plurality of substrates 14 arrayed at predetermined intervals; a processing chamber lower heat insulation portion provided below an array region of the substrates, and composed of a plurality of heat insulating members; a gas supply system for supplying a processing gas into the processing chamber; and a controller performing control such that the gas supply system supplies the processing gas into the processing chamber to form silicon carbide films on the substrates. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011082326(A) |
申请公布日期 |
2011.04.21 |
申请号 |
JP20090233201 |
申请日期 |
2009.10.07 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
HIROCHI SHIYU;YAMAGUCHI TENWA;SHIRAKO KENJI;NISHIDO SHUHEI |
分类号 |
H01L21/205;C23C16/42;C23C16/44 |
主分类号 |
H01L21/205 |
代理机构 |
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地址 |
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