发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an epitaxial film-forming apparatus including a sufficient heat insulation structure for processing at high temperature. SOLUTION: A substrate processing apparatus includes: a processing chamber for processing a plurality of substrates 14 arrayed at predetermined intervals; a processing chamber lower heat insulation portion provided below an array region of the substrates, and composed of a plurality of heat insulating members; a gas supply system for supplying a processing gas into the processing chamber; and a controller performing control such that the gas supply system supplies the processing gas into the processing chamber to form silicon carbide films on the substrates. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011082326(A) 申请公布日期 2011.04.21
申请号 JP20090233201 申请日期 2009.10.07
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 HIROCHI SHIYU;YAMAGUCHI TENWA;SHIRAKO KENJI;NISHIDO SHUHEI
分类号 H01L21/205;C23C16/42;C23C16/44 主分类号 H01L21/205
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