发明名称 LIGHT EMITTING DIODE ASSEMBLY
摘要 An electronic assembly includes a Light Emitting Diode (LED) mounted on a top surface of a heat spreader, at least two electrical contacts co-planar with the heat spreader, and at least one heat slug mounted on the top surface of the heat spreader, where the heat slug is made of high thermal conductive plastic.
申请公布号 US2011089460(A1) 申请公布日期 2011.04.21
申请号 US20090581811 申请日期 2009.10.19
申请人 AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. 发明人 YONG LIG YI;KEH KEAN LOO;NG KEAT CHUAN
分类号 H01L33/00 主分类号 H01L33/00
代理机构 代理人
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