STACKING-TYPE SOLID STATE DRIVE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A stacked solid state drive and a manufacturing method thereof are provided to reduce the size of the stacked solid state drive by mounting a passive device, a control semiconductor chip, and a functional semiconductor chip in the recess region of a substrate. CONSTITUTION: A substrate(100) includes one or more recess regions. A passive device(110) is mounted in one or more recess regions. A control semiconductor chip(120) is mounted in one or more recess regions. A buffer memory semiconductor chip(160) is mounted in one or more recess regions. An external access terminal is positioned on one side of the substrate.