发明名称 MASK FOR PRINTING SOLDER AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a mask for printing solder and a method of manufacturing a printed circuit board using the same. <P>SOLUTION: The mask is a mask for printing solder on a printed circuit board, and characterized in including a plate having a through hole formed, a nozzle portion provided protruding downward from the plate corresponding to the through hole, and a support member provided, protruding downward, to a lower surface of the plate so as to support the plate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011082498(A) 申请公布日期 2011.04.21
申请号 JP20100180398 申请日期 2010.08.11
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM JOON KON;LEE MYUNG GU
分类号 H05K3/34 主分类号 H05K3/34
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