发明名称 WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a capacity element built-in type wiring board large in capacity value, small in occupation area, relatively low in height and free from terminal connection failure. <P>SOLUTION: A capacitor CAP is embedded in a board resin layer 6 in a wiring board. The capacitor CAP includes a first capacitive electrode 2, a dielectric film 3 and a second capacitive electrode 4. The first capacitive electrode 2 has a surface shaped with successive protruded steps such as protruded step members 23 or the like. The dielectric film 3 covers the surface and an electrode material of a reinforcing electrode member 42 (a part of the second capacitive electrode 4) with the dielectric film interposed between the protruded steps on the surface is filled. The reinforcing electrode member 42 also serves as a reinforcing member of maintaining and reinforcing the surface shape of the protruded steps. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011082301(A) 申请公布日期 2011.04.21
申请号 JP20090232506 申请日期 2009.10.06
申请人 SONY CORP 发明人 HORIUCHI SATOSHI
分类号 H01L23/12;H05K3/46 主分类号 H01L23/12
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