发明名称 SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor substrate capable of preventing the occurrence of cracks when forming an epitaxial layer on a nitride layer, and preventing the detachment of the epitaxial layer from the semiconductor substrate, and to provide a method of manufacturing the same. SOLUTION: A semiconductor substrate 10a is used for forming an epitaxial layer on the principal plane 12a of a nitride layer 12. The substrate includes a heterogeneous substrate 11, and a nitride layer 12 formed on the heterogeneous substrate 11. The nitride layer 12 includes a stress relief area. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011082393(A) 申请公布日期 2011.04.21
申请号 JP20090234464 申请日期 2009.10.08
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SATO FUMITAKA;YAGO AKIHIRO;MAEDA YOKO;MATSUMOTO NAOKI
分类号 H01L21/02;H01L21/20;H01L21/265;H01L29/47;H01L29/872 主分类号 H01L21/02
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