发明名称 |
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate capable of preventing the occurrence of cracks when forming an epitaxial layer on a nitride layer, and preventing the detachment of the epitaxial layer from the semiconductor substrate, and to provide a method of manufacturing the same. SOLUTION: A semiconductor substrate 10a is used for forming an epitaxial layer on the principal plane 12a of a nitride layer 12. The substrate includes a heterogeneous substrate 11, and a nitride layer 12 formed on the heterogeneous substrate 11. The nitride layer 12 includes a stress relief area. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011082393(A) |
申请公布日期 |
2011.04.21 |
申请号 |
JP20090234464 |
申请日期 |
2009.10.08 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
SATO FUMITAKA;YAGO AKIHIRO;MAEDA YOKO;MATSUMOTO NAOKI |
分类号 |
H01L21/02;H01L21/20;H01L21/265;H01L29/47;H01L29/872 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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