| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder-bump forming method for forming a solder bump having almost no void on a joining part containing copper, and a semiconductor-device manufacturing method using the same. <P>SOLUTION: The forming method of a solder bump 50 is used for forming a bump having a desired height by lead-free and tin-containing solder 60, 65 on a joining part 40 containing copper. The method includes: an intermediate solder supply step for supplying the solder 60, 65 on the joining part 40 at a height lower than a desired height; an intermediate reflow step for forming an intermediate solder bump 51 lower than the desired height by heating and melting the solder 60, 65; a final solder supply step for supplying the solder 60, 65 on the intermediate solder bump 51 to the desired height; and a final reflow step for forming the solder bump 50 having the desired height by heating and melting the solder 60, 65 on the intermediate solder bump 51. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
