| 摘要 |
A method for manufacturing an electronic assembly (27), including a circuit board (29) having at least one electronic component (9, 13), in which at least one electronic component (9) having contacting points (11) is initially fastened on a conductive film (1), the active side of the at least one electronic component (9) facing in the direction of the conductive film (1) and the contacting points (11) being positioned at contacting positions on the active side of the electronic component (9). The conductive film (1) having the at least one electronic component (9, 13) fastened thereto is then laminated onto a circuit board carrier (17), the at least one electronic component (9, 13) facing in the direction of the circuit board carrier (17). Finally, a printed conductor structure (25) is implemented by structuring the conductive film (1). Furthermore, the present invention relates to an electronic assembly.
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