摘要 |
<p>The arrangement (5) has a three-dimensional carrier (10) i.e. metallic lead frame, including conducting paths (40), where the carrier is made from a single flexible circuit board material. An evaluation system (60) is arranged on the carrier, and two sensors (30, 70) i.e. hall sensor, are orthogonally arranged to each other at the carrier and electrically connected with the evaluation system. The carrier includes connecting contacts (100, 110, 120) on which the arrangement is connected to an external device. The carrier is formed as an angle element with two base surfaces (12, 14). An independent claim is also included for a method for manufacturing a circuit arrangement for determining direction and magnitude of a vector field.</p> |