| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily control the thicknesses of plating for inner walls of through-holes according to differences of the heat-dissipating properties of the through-holes in a wiring board laminating a surface layer on one surface side of a core layer including the through-hole and dissipating heat by plating on the inner wall of the through-hole. <P>SOLUTION: The through-holes 30 and 31 include a first through-hole 30 and a second through-hole 31 having different heat-dissipating properties. In the first through-hole 30 having a larger heat-dissipating property, two or more pieces of the plating 32 are laminated. In the second through-hole 31 having a smaller heat-dissipating property, the plating 33 is composed only of one layer. The total thickness of the plating 32 of two or more of the layers in the first through-hole 30 is larger than that of the plating 33 in the second through-hole 31. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
