发明名称 SEMICONDUCTOR MANUFACTURING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device that has superior efficiency of cooling, capable of stably reforming an insulating film to a desired characteristics, and having an ultraviolet radiation device with a cooling mechanism. <P>SOLUTION: The semiconductor manufacturing device includes an ultraviolet light emission section 101, and an overcoat tube 102 arranged so that the ultraviolet light emission section 101 may be covered such that a space 103 is formed between the ultraviolet light emitting section 101 and the overcoat tube. The overcoat tube 102 includes a cooling medium flow-in port 104 to which a cooling medium flows to the inside of the space 103 and a cooing medium flow-out port 105 from which the cooling medium flows outside the space 103. Upper height of an inner wall of the overcoat tube 102 near the cooling medium flow-out port 105 is higher than that of the overcoat tube 102 near the cooling medium flow-in port 105. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011082288(A) 申请公布日期 2011.04.21
申请号 JP20090232185 申请日期 2009.10.06
申请人 PANASONIC CORP 发明人 TSUTSUE MAKOTO;NOMURA KOTARO
分类号 H01L21/316;H01L21/768;H01L23/522 主分类号 H01L21/316
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