发明名称 Packaging Structure of AC light-emitting diodes
摘要 A packaging structure of AC LEDs is provided, which comprises: a carrier containing a positive electrode connecting end, and a negative electrode connecting end; an AC LED module disposed on the carrier, wherein the AC LED module electrically connects to the positive electrode connecting end and the negative electrode connecting end of the carrier; and a die-bonding insulating layer disposed between the AC LED module and the carrier.
申请公布号 US2011089443(A1) 申请公布日期 2011.04.21
申请号 US20100801704 申请日期 2010.06.22
申请人 FORWARD ELECTRONICS CO., LTD. 发明人 HSU HUI-WEN
分类号 H01L33/62;H01L33/48 主分类号 H01L33/62
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