| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has a light receiving surface opposite to a surface provided with an external electrode and allows it be miniaturized. <P>SOLUTION: A die pad 9B made of metal is formed on a metal plate 91 which has flexibility, and a semiconductor element 2B is mounted on the die pad 9B. Bumps 5B are stacked and formed in a plurality of stages on a terminal 22B of the semiconductor element 2B, and the whole is sealed with a resin seal 92. An upper surface of the resin seal 92 is polished until the bump 5B appears to form the external electrode 6B. The metal plate 91 is peeled from the resin seal 92, and dicing is then performed. <P>COPYRIGHT: (C)2011,JPO&INPIT |
