发明名称 HEAT TRANSFER DEVICE AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat transfer device enabling stable heat transfer and electronic equipment including the heat transfer device. <P>SOLUTION: An evaporation part 7 constituted of a plurality of evaporation structures 71 is provided in the heat receiving part 4 of a heat spreader 1 filled with a refrigerant. The evaporation structure 71 includes a lateral face 72 facing a flowing part 6 and a plurality of recesses 74 having openings 73 at a plurality of positions different from each other in the Z-axis direction of the lateral face 72, respectively. The recess 74 includes an inclination part 78 inclined to the direction containing components of the Z-axis direction. The inclination part 78 is provided at a portion closer to the heat receiving part 4 on the inner face of the recess 74 so as to form a V groove 61 between the two evaporation structures 71 adjacent to each other sandwiching the flowing part 6. Thus, at various height of a liquid level of a liquid refrigerant, a meniscus face having an efficient shape to evaporate and flow the liquid refrigerant can be formed. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011080679(A) 申请公布日期 2011.04.21
申请号 JP20090232991 申请日期 2009.10.07
申请人 SONY CORP 发明人 YAZAWA KAZUAKI;HASHIMOTO MITSUO
分类号 F28D15/02;H01L23/427 主分类号 F28D15/02
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