| 摘要 |
Provided are a stack-type solid-state drive (SSD) capable of reducing a size thereof by mounting semiconductor chips in a recess region formed in a substrate, and a method of fabricating the stack-type SSD. The stack-type SSD includes a substrate including one or more recess regions; one or more passive electronic elements mounted in the one or more recess regions; one or more control semiconductor chips mounted in the one or more recess regions; one or more non-volatile memory semiconductor chips mounted on a first surface of the substrate so as to overlap the one or more passive electronic elements, the one or more control semiconductor chips, or all the passive electronic elements and the control semiconductor chips; and an external connection terminal located on a side of the substrate.
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