发明名称 |
USING INTERRUPTED THROUGH-SILICON-VIAS IN INTEGRATED CIRCUITS ADAPTED FOR STACKING |
摘要 |
In an integrated circuit (IC) adapted for use in a stack of interconnected ICs, interrupted through-silicon-vias (TSVs) are provided in addition to uninterrupted TSVs. The interrupted TSVs provide signal paths other than common parallel paths between the ICs of the stack. This permits IC identification schemes and other functionalities to be implemented using TSVs, without requiring angular rotation of alternate ICs of the stack. |
申请公布号 |
WO2011026218(A9) |
申请公布日期 |
2011.04.21 |
申请号 |
WO2010CA01321 |
申请日期 |
2010.08.27 |
申请人 |
GILLINGHAM, PETER B.;MOSAID TECHNOLOGIES INCORPORATED |
发明人 |
GILLINGHAM, PETER B. |
分类号 |
H01L23/488;G11C5/06;H01L21/71;H01L21/98;H01L23/50;H03K17/56 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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