STRUCTURE FOR PACKAGING

摘要

PURPOSE: A package structure is provided to stack an FBAR(Film Bulk Acoustic Resonator) and an inductor to minimize a size change of a planar area, thereby miniaturizing a product. CONSTITUTION: A resonator(20) is formed on a substrate(10). A plurality of inductors(50) is stacked on a capping substrate(30). The inductors are electrically connected to contact pads(18) formed on both sides of the substrate through a first via contact(32). The contact pads are connected to a lower electrode(22) and an upper electrode(24) of the resonator. The lower electrode and the upper electrode are insulated from the substrate by an interlayer insulating film(12) formed on the substrate.