发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE |
摘要 |
Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.
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申请公布号 |
US2011089563(A1) |
申请公布日期 |
2011.04.21 |
申请号 |
US20100900407 |
申请日期 |
2010.10.07 |
申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
KIKUCHI TAKASHI;HASHIMOTO TOMOAKI;HIRAI TATSUYA |
分类号 |
H01L23/48;H01L21/50 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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