| 摘要 |
A polyamic acid resin composition, and a polyimide film and laminate prepared therefrom are provided. The polyamic acid resin composition includes a polyamic acid resin, a solvent, and a polar aprotic solution containing nanoscale silica, with surface hydroxyl groups, modified by a surface modification agent. Particularly, the surface modification agent has a structure represented by formula (I): R1—Si—(OR2)3 formula (I) wherein, R1 is an aliphatic group or an aryl group, and R2 is a C1-8 alkyl group.
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