| 摘要 |
PURPOSE: An electric copper plating bath and an electric copper plating method are provided to maintain good balance between promoter effect and controller effect caused by an organic additive and implement high-speed plating. CONSTITUTION: An electric copper plating bath comprises copper sulfate pentahydrate of 50-250g/liter, sulfuric acid of 20-200g/liter, chloride ion of 20-150mg/liter, sulfur-atom containing organic compound serving as an organic additive, and nitrogen-atom containing organic compound. The nitrogen-atom containing organic compound is prepared through steps of making morpholine of 1 mol react with epichlorohydrin of 2 mol in acidic aqueous solution and making imidazole of 1-2 mol to morpholine of 1 mol react with the product.
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