| 发明名称 |
BACKLIGHT UNIT AND METHOD FOR MANUFACTURING THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To join a heat sink to a bottom chassis and to provide effect on improvement in heat dissipation efficiency with respect to a backlight unit. <P>SOLUTION: The present invention relates to the backlight unit including a printed circuit board having a plurality of injection holes formed; a plurality of light-emitting diode packages which include the heat sink and are inserted into the injection holes respectively to be mounted, the heat sink being exposed on one surface of the printed circuit board; and a bottom chassis to which the printed circuit board is coupled, the heat sink of the light-emitting diode packages being joined to the bottom chassis. The present invention provides the effect on improvement in heat dissipation efficiency since the heat sink is joined directly to the bottom chassis. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| 申请公布号 |
JP2011082492(A) |
申请公布日期 |
2011.04.21 |
| 申请号 |
JP20100141753 |
申请日期 |
2010.06.22 |
| 申请人 |
ALTI-SEMICONDUCTOR CO LTD |
发明人 |
PARK IK SEONG;KANG SANG MIN |
| 分类号 |
H01L33/62;F21S2/00;F21V19/00;F21V29/00;F21Y101/02;G02F1/13357;H01L33/00;H01L33/64 |
主分类号 |
H01L33/62 |
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