发明名称 DEVICE FOR MOLDING RESIN MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a device for molding a resin molded article, which prevents a weld line from being produced during resin molding. SOLUTION: The device 10 of molding the resin molded article includes a heating device 11 for heating a mold and a cooling device 20 for cooling the mold after being heated, and a heating means 15 of the heating device 11 is disposed at the producing place of the weld line A in the vicinity of a cavity 30. Furthermore, the heating device 11 includes the heating means 15, a heater unit 12 for heating the heating means 15, a thermal conductor 13 for covering the heater unit 12, and a heat insulating plate 14 for holding the thermal conductor 13. Furthermore, the heating means 15 and the mold are tightly adhered to each other through soldering. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011079278(A) 申请公布日期 2011.04.21
申请号 JP20090235351 申请日期 2009.10.09
申请人 HEISEI MOLDING CO LTD 发明人 ARAI SHINICHI
分类号 B29C33/02;B29C33/38;B29C45/26 主分类号 B29C33/02
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