PLASMA REACTOR FOR ABATING HAZARDOUS MATERIALS AND DRIVING METHOD THEREOF

摘要

The present invention provides a plasma reactor for abating hazardous materials generated in a low-pressure process during a process of manufacturing a display or a semiconductor. A plasma reactor for abating hazardous materials according to an exemplary embodiment of the present invention includes: a first ground electrode and a second ground electrode disposed at a distance from each other; a dielectric fixed between the first ground electrode and the second ground electrode; and at least one driving electrode disposed on an outer surface of the dielectric, being spaced apart from the first ground electrode and the second ground electrode and connected to an AC power supply unit to receive a driving voltage therefrom.