发明名称 PHOTORESIST COMPOSITION
摘要 <p>PURPOSE: A photo-resist composition is provided to form photo-resist patterns with the superior line-width roughness and obtain the superior resolution and the adhesive property of photo-resist. CONSTITUTION: A photo-resist composition includes polymer, a resin, and an acid generator. The polymer includes a unit structure derived from a compound represented by chemical formula 1. The resin includes acid-labile group and is soluble in an alkaline aqueous solution by the action of acid. In the chemical formula 1, R1 is hydrogen or methyl group. R2 is C6 to C12 of substituted aromatic hydrocarbon. R3 is cyano group or C1 to C12 of substituted hydrocarbon with one or more hetero elements. A1 represents a single bond, -(CH_2)_g-CO-O-*, or -(CH_2)_h-OCO-(CH_2)_i-CO-O-*. g, h, and I are respectively the integer of 1 to 6. * is the bonding position of nitrogen element.</p>
申请公布号 KR20110041415(A) 申请公布日期 2011.04.21
申请号 KR20100099738 申请日期 2010.10.13
申请人 SUMITOMO CHEMICAL CO., LTD. 发明人 MASUYAMA TATSURO;HASHIMOTO KAZUHIKO;SHIGEMATSU JUNJI
分类号 G03F7/004;H01L21/027 主分类号 G03F7/004
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